| Teacher's name | Research Units | Year | Project title | Project position | Commissioning unit | Implementation period |
|---|---|---|---|---|---|---|
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2025 | 專業技術服務-真空閥門元件接觸表面鍍層變形分析 | PI | 日揚科技股份有限公司 | 2025/04/01-2025/07/31 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2024 | 新世代HBPoP高散熱結構之探討 | PI | 日月光半導體製造股份有限公司 | 2024/10/01-2025/09/30 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2024 | 電子封裝焊料具溫度效應/高應變率力學本構模型結合數值分析之研究 | Co-PI | 國家科學及技術委員會 | 2024/08/01-2025/07/31 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2024 | 先進電子封裝於掉落負載下其焊料於之高應變率力學響應分析與可靠度壽命預測 | Co-PI | 日月光半導體製造股份有限公司 | 2024/03/01-2025/04/30 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2023 | IC包裝用 JEDEC Tray 符合最佳結構強度以延長使用壽命之探討 | Co-PI | 日月光半導體製造股份有限公司 | 2023/10/01-2024/09/30 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2023 | 嘉基整合型計畫-(子計畫分項二)客製化3D列印鈦合金頭蓋骨之有限元素分析 | Co-PI | 戴德森醫療財團法人嘉義基督教醫院 | 2023/01/01-2023/12/31 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2023 | 嘉基整合型計畫-(子計畫分項三)運用數位攤平分析技術改善3D列印放射治療組織填充物設計(二) | Co-PI | 戴德森醫療財團法人嘉義基督教醫院 | 2023/01/01-2023/12/31 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2023 | IC包裝用JEDEC Tray符合最佳結構強度以延長使用壽命之探討 | Co-PI | 日月光半導體製造股份有限公司 | 2023/10/01-2024/09/30 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2023 | SiC功率半導體之先進封裝晶粒切割擴片製程最佳化與虛實整合技術開發 | PI | 國家科學及技術委員會 | 2023/08/01-2024/10/31 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2022 | 旋轉連續式熱處理設備及製程CAE技術開發 | Co-PI | 財團法人金屬工業研究發展中心 | 2022/01/01-2022/12/31 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2022 | 手工具棒材熱處理組織變化模擬分析 | PI | 財團法人金屬工業研究發展中心 | 2022/04/01-2022/06/30 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2022 | 前瞻製造系統頂尖研究中心(5/5) | SI | 國科會 | 2022/03/01-2023/02/28 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2022 | SiC分割製程之機械應力與裂解技術機制分析 | SI | 日月光半導體製造股份有限公司 | 2022/10/01-2023/09/30 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2022 | 創新異質性無限元素法應用於SLM製程材料力學性質評估技術開發 | PI | 國科會 | 2022/08/01-2023/07/31 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2022 | 嘉基整合型計畫-(子計畫分項二)客製化3D列印鈦合金頭蓋骨之CAD/Lattice Design/Printing整合技術的開發 | Co-PI | 戴德森醫療財團法人嘉義基督教醫院 | 2022/01/01-2022/12/31 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2022 | 嘉基整合型計畫-(子計畫分項三)運用數位攤平分析技術改善3D列印放射治療組織填充物設計 | Co-PI | 戴德森醫療財團法人嘉義基督教醫院 | 2022/01/01-2022/12/31 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2021 | 金屬板材成形製程模具結構分析 | Co-PI | 財團法人金屬工業研究發展中心 | 2021/06/01-2021/12/31 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2021 | 產學合作計畫-薄壁高硬度材料圓筒形產品加工之先進數位化製造 | Co-PI | 國科會 | 2021/06/01-2022/05/31 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2021 | 產學合作計畫-薄壁高硬度材料圓筒形產品加工之先進數位化製造 | Co-PI | 冠億齒輪股份有限公司 | 2021/06/01-2022/05/31 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2021 | 成形模具結構應力分析 | PI | 財團法人金屬工業研究發展中心 | 2021/07/01-2021/12/31 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2021 | 板材成形及模具應力分析 | PI | 財團法人金屬工業研究發展中心 | 2021/09/01-2021/12/31 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2021 | 創新無限元素法應用於SLM製程材料力學性質評估技術開發 | PI | 國科會 | 2021/08/01-2022/07/31 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2020 | 熱固耦合拓樸與CAE分析技術開發與熱親和結構設計 | PI | 永進機械工業股份有限公司 | 2020/11/01-2023/12/31 |
| Zhuang, Zhen Wei | Advanced Institute of Manufacturing with High-Tech Innovations | 2016 | 手機相機光學防手震模組之設計與驗證 | SI | 恩得利工業股份有限公司 | 2016/01/01-2016/12/31 |