Scopus
Article
1
Effects of Minor Ga Addition on Interfacial Reactions Between Sn-Ga Solders and Cu
Wang C.H., Li K.T., Yen Y.W.
JOM
2024, 76 (6) , 2731-2740
Article
2
Interfacial Reactions between Sn-Based Solders and n-Type Bi2 (Te,Se)3 Thermoelectric Material
Wang C.H., Chiu C.W., Li M.H.
Materials
2024, 17 (9)
Article
3
Systematic Study of Liquid-State Interfacial Reactions Between Co and In-Sn Solders with Varying Sn Contents
Wang C.H., Chang T.Y.
Journal of Electronic Materials
2024
Article
4
Unexpected interfacial reactions in Co/Sb2 Te3 and Co/GeTe couples
Chen S.w., Wang C.h., Chang J.R., Yang H.C., Lai Y.h., Chen Y.
Journal of the Taiwan Institute of Chemical Engineers
2023, 147
Article
5
Strong inhibition of boron dopant on IMC growth between electroplating Co(B) deposits and lead-free solders at 250 °C
Wang C.h., Guo Y.b.
Journal of Materials Science: Materials in Electronics
2023, 34 (15)
Article
6
Investigation of the Interfacial Reactions between the CoCuFeNi High Entropy Alloy and Sn Solder
Chiang T.Y., Chang Y.C., Wang C.H., Laksono A.D., Yen Y.W.
Metals
2023, 13 (4)
Article
7
Reaction mechanism for liquid-state interfacial reactions of Co with In and eutectic In–48at.%Sn solders
Wang C.h., Chang T.Y.
Journal of Materials Science: Materials in Electronics
2022, 33 (15) , 12321-12333
Article
8
Minor Ge Addition to Suppress the IMC Growth in Interfacial Reactions of Co with Sn-Ag-Ge and Sn-Ag-Cu-Ge Solders
Wang C.h., Chen K.H., Tsai J.Y.
Journal of Electronic Materials
2022, 51 (4) , 1820-1830
Article
9
Liquid-State Interfacial Reactions of Sn and Sn-Ag-Cu Solders with p-Type (Bi,Sb)2 Te3 Thermoelectric Material
Wang C.h., Li M.h., Chiu C.w., Wang X.H.
JOM
2020, 72 (10) , 3558-3566
Article
10
Phase diagram of Bi–In–Se ternary system
Chen S.w., Hutabalian Y., Gierlotka W., Wang C.h., Lu S.t.
Calphad: Computer Coupling of Phase Diagrams and Thermochemistry
2020, 68
學術著作
1
Kinetic study of solid-state interfacial reactions of p-type (Bi,Sb)2Te3 thermoelectric materials with Sn and Sn–Ag–Cu solders
C.-H. Wang, M.-H. Li, C.-W. Chiu and T.-Y. Chang
Journal of Alloys and Compounds
2018 年
10 月
Journal of Alloys and Compounds,Vol.767, No.,pp.1133-1140
期刊論文
2
Effects of Zn and Ga Additions to Suppress PdSn4 Growth at a Solder/Pd Interface Under Current Stressing
C.-H. Wang, K.-T. Li and K.-H. Chen
Journal of Electronic Materials
2018 年
1 月
Journal of Electronic Materials,Vol.47, No.1,pp.1-8
期刊論文
3
Study of electromigration resistance of (Pd,Ni)Sn4 phase in lead-free solder joints
C.-H. Wang* and K.-T. Li
Journal of Alloys and Compounds
2016 年
1 月
Journal of Alloys and Compounds,Vol.654, No.,pp.546-553
期刊論文
4
Metastable CoSn4 formation induced by minor Ga addition and effective suppression effect on the IMC growth in solid-state Sn-Ga/Co reactions
C.-H. Wang, K.-T. Li and P.-Y. Huang
Journal of Materials Science
2016 年
8 月
Journal of Materials Science,Vol.51, No.15,pp.7309-7321
期刊論文
5
Phase equilibria of the ternary Sn-Zn-Co system at 250oC and 500oC
C.-H. Wang*, S.-E. Huang and P.-Y. Huang
Journal of Electronic Materials
2015 年
10 月
Journal of Electronic Materials,Vol.44, No.12,pp.4907-4919
期刊論文
6
Pseudocapacitive performance of Co(OH)2 enhanced by Ni(OH)2 formation on porous Ni/Cu electrode
C.-H. Wang*, J.-L. Liu and H.-Y. Huang
Electrochimica Acta
2015 年
11 月
Electrochimica Acta,Vol.182, No.,pp.47-60
期刊論文
7
Minor Ga addition to effectively inhibit PdSn4 growth between Sn solder and Pd substrate
C.-H. Wang*, K.-T. Li and C.-Y. Lin
Intermetallics
2015 年
12 月
Intermetallics,Vol.67, No.,pp.102-110
期刊論文
8
Peltier effect on CoSn3 growth in Sn/Co/Sn couples with different substrate lengths
C.-H. Wang* and C.-Y. Kuo
Materials Chemistry and Physics
2015 年
3 月
Materials Chemistry and Physics,Vol.153, No.,pp.72-77
期刊論文
9
Growth kinetics and mechanism of Pd2Zn9 at the interface of Pd substrate with molten Sn-9wt.%Zn solder
C.-H. Wang* and K.-T. Li
Materials Chemistry and Physics
2015 年
8 月
Materials Chemistry and Physics,Vol.164, No.,pp.223-229
期刊論文
10
Effects of Sn thickness on morphology and evolution of Ni3Sn4 grains formed between molten Sn and Ni substrate
C.-H. Wang* and J.-L. Liu
Intermetallics
2015 年
6 月
Intermetallics,Vol.61, No.,pp.9-15
期刊論文