Scholar's profile
Liu, Deshin
Professor
Scopus Data (view scopus profile)
Publication Achievements
1995 - 2025
Publication Index
Documents
139
CITATIONS
944
H-INDEX
16
FWCI
0.22
Co-authors
192
Last Sync Date: 2025-08-17
Google Scolar
ORCID
Scopus
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1Article
Study on the impact of different wound dressings on surface dose and deep dose analysis in head and neck radiation therapy
Radiation Physics and Chemistry 2025, 2370Citation0.00FWCI -
2Article
Microstructure and mechanical properties modification through in-situ heat treatment of AlSi10Mg/CNTs Composites prepared through additive manufacturing
Materials Letters 2025, 3980Citation0.00FWCI -
3Article
Uniaxial tensile and compressive deformation performance of closed-cell aluminum hybrid foams
Materials Chemistry and Physics 2025, 3421Citation0.00FWCI -
4Article
Demonstration of curing degree estimation approach of EVA foam during injection moulding by integrating thermal–physical characteristics and FEA simulation
Polymer Bulletin 2025, 82 (5) , 1643-16620Citation0.00FWCI -
5Article
Microstructural and mechanical properties study of various lattice structures of SS316L-CNTs nano composites fabricated through additive manufacturing
Journal of Physics D Applied Physics 2025, 58 (6)1Citation0.00FWCI -
6Article
Manufacturing Reliability Assessment of Fine Ag Alloy Wire During Wire Loop Formation Process
IEEE Access 2025, 13 , 14177-141850Citation0.00FWCI -
7Article
Carbon nanotubes used to enhance the wear properties of AlSi10Mg/CNTs nanocomposites prepared through additive manufacturing
Diamond and Related Materials 2024, 1444Citation0.59FWCI -
8Article
Investigation of process-induced periodic structure on n-type 4H-SiC with corresponding mechanical characteristics estimation
Materials Today Communications 2024, 380Citation0.00FWCI -
9Article
Injection moulding process parameter and strain rate dependence mechanical properties measurement and theoretical estimation of EVA polymer foam
Journal of Mechanics 2024, 40 , 1-92Citation0.79FWCI -
10Article
Temperature-dependence mechanical characteristics investigation of Cu wire and corresponding high strain rate plasticity behaviors enabled by Johnson-Cook constitutive model
Journal of Mechanics 2023, 39 , 334-3432Citation0.33FWCI
Publication
Print-friendly-
1 Microstructural and mechanical properties study of various lattice structures of SS316L-CNTs nano composites fabricated through additive manufacturingJ. Phys. D: Appl. Phys. 2025 / 2Journal Article
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2 Manufacturing Reliability Assessment of Fine Ag Alloy Wire During Wire Loop Formation ProcessIEEE Access 2025 / 1Journal Article
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3 Injection moulding process parameter and strain rate dependence mechanical properties measurement and theoretical estimation of EVA polymer foamJournal of Mechanics 2024 / 1Journal Article
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4 Carbon nanotubes used to enhance the wear properties of AlSi10Mg/CNTs nanocomposites prepared through additive manufacturingDiamond and Related Materials 2024 / 4Journal Article
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5 Investigation of process-induced periodic structure on n-type 4H-SiC with corresponding mechanical characteristics estimationMaterials Today Communications 2024 / 3Journal Article
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6 Demonstration of curing degree estimation approach of EVA foam during injection moulding by integrating thermal-physical characteristics and FEA simulationPolymer Bulletin 2024 / 11Journal Article
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7 Temperature-Dependence Mechanical Characteristics Investigation of Cu Wire and Corresponding High Strain Rate Plasticity Behaviors Enabled by Johnson-Cook Constitutive ModelJournal of Mechanics 2023 / 8Journal Article
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8 Development of a Novel Dynamic Modeling Approach for a Three Axis Machine Tool in Mechatronic IntegrationMachines 2022 / 11Journal Article
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9 Investigation into Thermo-mechanical Reliability of Copper Trace Lines in Stacked Ball Grid Array PackagingMicroelectronics Reliability 2022 / 3Journal Article
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10 A novel identification technique of machine tool support stiffness under the variance of structural weightThe International Journal of Advanced Manufacturing Technology 2022 / 1Journal Article
Projects
Print-friendly| Teacher's name | Research Units | Year | Project title | Project position | Commissioning unit | Implementation period |
|---|---|---|---|---|---|---|
| Liu, Deshin | Department of Mechanical Engineering | 2025 | 高教深耕－前瞻製造系統頂尖研究中心 | Co-PI | 教育部 | 2025/01/01-2025/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2025 | 專業技術服務-真空閥門元件接觸表面鍍層變形分析 | Co-PI | 日揚科技股份有限公司 | 2025/04/01-2025/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2025 | AI驅動半導體晶圓研磨技術之開發與關鍵元件之智慧製造(1/2) | Co-PI | 國家科學及技術委員會 | 2025/06/01-2026/05/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2025 | 高教深耕－前瞻製造系統頂尖研究中心【半導體製程】 | PI | 教育部 | 2025/01/01-2025/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2024 | 新世代HBPoP高散熱結構之探討 | Co-PI | 日月光半導體製造股份有限公司 | 2024/10/01-2025/09/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2024 | 電子封裝焊料具溫度效應/高應變率力學本構模型結合數值分析之研究 | PI | 國家科學及技術委員會 | 2024/08/01-2025/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2024 | 電子封裝新式鈀合金垂直探針應用於先進異質整合封裝針測製程的力學性質量測與可靠性分析 | PI | 國家科學及技術委員會 | 2024/08/01-2025/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2024 | 先進電子封裝於掉落負載下其焊料於之高應變率力學響應分析與可靠度壽命預測 | PI | 日月光半導體製造股份有限公司 | 2024/03/01-2025/04/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2024 | 先進加減整合製造之虛實整合及技術深化-先進加減整合製造之虛實整合及技術深化(4/4) | Co-PI | 國家科學及技術委員會 | 2024/06/01-2025/05/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2024 | 高教深耕－前瞻製造系統頂尖研究中心 | Co-PI | 教育部 | 2024/01/01-2024/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2024 | 「電子封裝技術介紹」儲訓課程(專業技術服務) | PI | 社團法人中華民國南部科學園區產學協會 | 2024/06/01-2024/09/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2024 | 高教深耕－前瞻製造系統頂尖研究中心【半導體製程】 | PI | 教育部 | 2024/01/01-2024/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2023 | IC包裝用 JEDEC Tray 符合最佳結構強度以延長使用壽命之探討 | PI | 日月光半導體製造股份有限公司 | 2023/10/01-2024/09/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2023 | 嘉基整合型計畫-(子計畫分項二)客製化3D列印鈦合金頭蓋骨之有限元素分析 | PI | 戴德森醫療財團法人嘉義基督教醫院 | 2023/01/01-2023/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2023 | 先進加減整合製造之虛實整合及技術深化-先進加減整合製造之虛實整合及技術深化(3/4) | Co-PI | 國家科學及技術委員會 | 2023/06/01-2024/06/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2023 | 嘉基整合型計畫-(子計畫分項三)運用數位攤平分析技術改善3D列印放射治療組織填充物設計(二) | PI | 戴德森醫療財團法人嘉義基督教醫院 | 2023/01/01-2023/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2023 | 嘉基整合型計畫-(分項子計畫七)金屬列印人工脊椎椎體支架 | Co-PI | 戴德森醫療財團法人嘉義基督教醫院 | 2023/01/01-2023/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2023 | 3-1 創新技術智慧製造 | PI | 教育部 | 2023/01/01-2023/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2023 | 3-1-1 創新技術智慧製造【前瞻中心】 | PI | 教育部 | 2023/01/01-2023/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2023 | 3-1-2 創新技術智慧製造【技廣中心】 | PI | 教育部 | 2023/01/01-2023/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2023 | 電子封裝合金銲材中高應變率拉伸實驗方法建立與Johnson-Cook組成方程式參數分析 | PI | 國家科學及技術委員會 | 2023/08/01-2024/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2023 | IC包裝用JEDEC Tray符合最佳結構強度以延長使用壽命之探討 | PI | 日月光半導體製造股份有限公司 | 2023/10/01-2024/09/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2023 | 具安全性異質工業物聯網之智慧製造系統場域建置與認證-具安全性異質工業物聯網之智慧製造系統場域建置與認證(3/3) | Co-PI | 國家科學及技術委員會 | 2023/06/01-2024/08/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2022 | 先進加減整合製造之虛實整合及技術深化-先進加減整合製造之虛實整合及技術深化(2/4) | Co-PI | 國科會 | 2022/06/01-2023/05/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2022 | 具安全性異質工業物聯網之智慧製造系統場域建置與認證-具安全性異質工業物聯網之智慧製造系統場域建置與認證(2/3) | Co-PI | 國科會 | 2022/06/01-2023/08/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2022 | 前瞻製造系統頂尖研究中心(5/5) | PI | 國科會 | 2022/03/01-2023/02/28 |
| Liu, Deshin | Department of Mechanical Engineering | 2022 | 高教深耕-高齡跨域創新研究中心【永續長照計畫】 | PI | 教育部 | 2022/01/01-2022/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2022 | SiC分割製程之機械應力與裂解技術機制分析 | PI | 日月光半導體製造股份有限公司 | 2022/10/01-2023/09/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2022 | 嘉基整合型計畫-(子計畫分項二)客製化3D列印鈦合金頭蓋骨之CAD/Lattice Design/Printing整合技術的開發 | PI | 戴德森醫療財團法人嘉義基督教醫院 | 2022/01/01-2022/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2022 | 產學合作計畫-六軸數控泛用型齒輪加工機設計與開發-六軸數控泛用型齒輪加工機設計與開發(II)(2/2) | Co-PI | 華鏞機械工業股份有限公司 | 2022/06/01-2023/10/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2022 | 產學合作計畫-六軸數控泛用型齒輪加工機設計與開發-六軸數控泛用型齒輪加工機設計與開發(II)(2/2) | Co-PI | 國科會 | 2022/06/01-2023/10/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2022 | 產學合作計畫-六軸數控泛用型齒輪加工機設計與開發-六軸數控泛用型齒輪加工機設計與開發(II)(2/2) | Co-PI | 前瞻傳動科技股份有限公司 | 2022/06/01-2023/10/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2022 | 嘉基整合型計畫-(子計畫分項三)運用數位攤平分析技術改善3D列印放射治療組織填充物設計 | PI | 戴德森醫療財團法人嘉義基督教醫院 | 2022/01/01-2022/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2022 | 嘉基整合型計畫-(分項子計畫七)金屬列印人工脊椎椎體支架 | Co-PI | 戴德森醫療財團法人嘉義基督教醫院 | 2022/01/01-2022/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2021 | 產學合作計畫-六軸數控泛用型齒輪加工機設計與開發-六軸數控泛用型齒輪加工機設計與開發(I)(1/2) | Co-PI | 國科會 | 2021/06/01-2022/09/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2021 | 產學合作計畫-六軸數控泛用型齒輪加工機設計與開發-六軸數控泛用型齒輪加工機設計與開發(I)(1/2) | Co-PI | 前瞻傳動科技股份有限公司 | 2021/06/01-2022/09/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2021 | 產學合作計畫-六軸數控泛用型齒輪加工機設計與開發-六軸數控泛用型齒輪加工機設計與開發(I)(1/2) | Co-PI | 華鏞機械工業股份有限公司 | 2021/06/01-2022/09/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2021 | 應用人工智慧於機聯網工具機之控制、預防維護與加工技術之研發(4/4) | Co-PI | 國科會 | 2021/01/01-2022/01/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2021 | 具安全性異質工業物聯網之智慧製造系統場域建置與認證-具安全性異質工業物聯網之智慧製造系統場域建置與認證(1/3) | Co-PI | 國科會 | 2021/11/01-2022/08/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2021 | 具內晶格結構之機械零件設計製造程序開發 | PI | 主創科技有限公司 | 2021/08/01-2022/03/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2021 | 前瞻製造系統頂尖研究中心(4/5) | PI | 國科會 | 2021/03/01-2022/05/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2021 | 先進加減整合製造之虛實整合及技術深化-先進加減整合製造之虛實整合及技術深化(1/4) | Co-PI | 國科會 | 2021/06/01-2022/05/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2021 | 創新無限元素法應用於SLM製程材料力學性質評估技術開發 | Co-PI | 國科會 | 2021/08/01-2022/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2020 | 客製化高價值產品之先進多功能整線系統研發-客製化高價值產品之先進多功能整線系統研發(3/3) | Co-PI | 國科會 | 2020/11/01-2021/08/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2020 | 109年高階鞋材含浸發泡成型開發計畫(1/1)-批次液氮含浸發泡製程技術開發 | PI | 財團法人鞋類暨運動休閒科技研發中心 | 2020/09/01-2021/03/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2020 | 熱固耦合拓樸與CAE分析技術開發與熱親和結構設計 | Co-PI | 永進機械工業股份有限公司 | 2020/11/01-2023/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2020 | 具安全性異質工業物聯網之智慧製造系統場域建置與認證 | Co-PI | 財團法人國家實驗研究院台灣儀器科技研究中心 | 2020/12/01-2021/05/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2020 | 前瞻製造系統頂尖研究中心(3/5) | PI | 國科會 | 2020/03/01-2021/04/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2020 | 2-1科技拔尖、形塑聚落 | PI | 教育部 | 2020/01/01-2020/01/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2020 | AI-enhanced 數位光製造材料配方優化UI委託研究 | PI | 財團法人工業技術研究院 | 2020/09/15-2020/11/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2020 | 3D列印進階圖像自動化委託研究 | PI | 財團法人工業技術研究院 | 2020/04/13-2020/07/12 |
| Liu, Deshin | Department of Mechanical Engineering | 2020 | 應用人工智慧於機聯網工具機之控制、預防維護與加工技術之研發(3/4) | Co-PI | 國科會 | 2020/01/01-2020/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2019 | (劉德騏)108-109年優秀外國青年來臺蹲點計畫-2月核定 | PI | 教育部 | 2019/01/01-2020/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2019 | 童車類產品強度及汽車安全座椅模擬及相關器材借用 | PI | 英屬維京群島商貫新企業股份有限公司台灣分公司 | 2019/03/01-2019/09/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2019 | 高教深耕－前瞻製造系統頂尖研究中心【價創計畫】 | PI | 教育部 | 2019/01/01-2019/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2019 | 3D列印圖像自動化技術 | PI | 財團法人工業技術研究院 | 2019/10/18-2019/12/13 |
| Liu, Deshin | Department of Mechanical Engineering | 2019 | 2-1科技拔尖、形塑聚落 | PI | 教育部 | 2019/01/01-2019/09/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2019 | 前瞻製造系統頂尖研究中心(2/5) | PI | 國科會 | 2019/03/01-2020/04/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2019 | (劉德騏)108-109年優秀外國青年來臺蹲點計畫-12月核定(整合型) | PI | 教育部 | 2019/12/03-2023/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2019 | 應用人工智慧於機聯網工具機之控制、預防維護與加工技術之研發(2/4) | Co-PI | 國科會 | 2019/01/01-2019/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2019 | 客製化高價值產品之先進多功能整線系統研發-客製化高價值產品之先進多功能整線系統研發(2/3) | Co-PI | 國科會 | 2019/12/01-2020/10/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2019 | 103至107學年度期間核定補助「大學校院產學合作培育博士級研發人才計畫-前瞻製造系統博士學位學程」之108學年度補助經費 | PI | 教育部 | 2019/08/01-2020/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2019 | (前瞻頂尖研究中心管理費)108CF056/RSC計畫-智慧數位製鞋客製化製造技術服務創新 | PI | 教育部 | 2019/08/01-2022/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2018 | 客製化高價值產品之先進多功能整線系統研發-客製化高價值產品之先進多功能整線系統研發(1/3) | Co-PI | 國科會 | 2018/12/01-2020/01/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2018 | 價創計畫：智慧製造虛實系統整合技術-五軸數控重切削戟齒輪加工機開發II | Co-PI | 國科會 | 2018/05/01-2019/04/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2018 | 機械固力學門研究發展及推動規劃小組計畫(3/3) | PI | 國科會 | 2018/01/01-2018/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2018 | 智慧機器人自造與人才培育計畫-整合智慧機械、金融科技與數位學習之創新自造基地 | Co-PI | 國科會南部科學工業園區管理局 | 2018/01/16-2018/11/15 |
| Liu, Deshin | Department of Mechanical Engineering | 2018 | 應用人工智慧於機聯網工具機之控制、預防維護與加工技術之研發(1/4) | Co-PI | 國科會 | 2018/01/01-2018/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2018 | 2-1科技拔尖、形塑聚落 | PI | 教育部 | 2018/01/01-2018/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2018 | 工具機數位設計製造與智慧控制技術聯盟(3/3) | Co-PI | 國科會 | 2018/03/01-2019/05/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2018 | 前瞻製造系統頂尖研究中心(1/5)(原名稱:智能化工具機與先進製程技術研發(1/5) | PI | 國科會 | 2018/03/01-2019/05/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2017 | 電子封裝細長型晶元斷裂及剝離強度實驗與動態植晶參數分析(3/3) | PI | 國科會 | 2017/08/01-2018/05/15 |
| Liu, Deshin | Department of Mechanical Engineering | 2017 | 工具機數位設計製造與智慧控制技術聯盟(2/3) | Co-PI | 國科會 | 2017/03/01-2018/05/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2017 | 產業領航計畫-單機智慧化相關技術研究 | Co-PI | 東台精機股份有限公司 | 2017/10/01-2020/03/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2017 | 價創計畫：智慧製造虛實系統整合技術-五軸數控重切削戟齒輪加工機開發 | PI | 國科會 | 2017/05/01-2018/04/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2017 | 機械固力學門研究發展及推動規劃小組計畫(2/3) | PI | 國科會 | 2017/01/01-2017/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2017 | 產學合作計畫-開發型智能化精密級齒輪磨床研發(2/2) | PI | 陸聯精密股份有限公司 | 2017/02/01-2018/01/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2017 | 產學合作計畫-開發型智能化精密級齒輪磨床研發(2/2) | PI | 國科會 | 2017/02/01-2018/01/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2017 | 產學合作計畫-開發型智能化精密級齒輪磨床研發(2/2) | PI | 上銀科技股份有限公司 | 2017/02/01-2018/01/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2016 | 工具機數位設計製造與智慧控制技術聯盟(1/3) | Co-PI | 國科會 | 2016/03/01-2017/05/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2016 | 工具機機電整合分析技術 | PI | 東台精機股份有限公司 | 2016/07/01-2019/06/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2016 | 積層列印材料動態測試方法之開發與結構優化 | PI | 寶成工業股份有限公司 | 2016/10/01-2019/03/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2016 | 博士後研究蔡進源-電子封裝細長型晶元斷裂及剝離強度實驗與動態植晶參數分析 | PI | 國科會 | 2016/07/01-2017/06/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2016 | 電子封裝細長型晶元斷裂及剝離強度實驗與動態植晶參數分析(2/3) | PI | 國科會 | 2016/08/01-2018/05/15 |
| Liu, Deshin | Department of Mechanical Engineering | 2016 | 105大專生計畫-電子封裝(IC)中植晶流程之細長型晶圓斷裂強度/(剝離強度)的實驗與研究 | PI | 國科會 | 2016/07/01-2017/02/28 |
| Liu, Deshin | Department of Mechanical Engineering | 2016 | 機械固力學門研究發展及推動規劃小組計畫(1/3) | PI | 國科會 | 2016/01/01-2016/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2016 | 嘉義縣市產業先期調研計畫-子計畫1:「智慧機械」 | Co-PI | 財團法人工業技術研究院 | 2016/10/01-2017/08/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2016 | 台俄(RU)國合計畫-考慮包辛格效應之薄板及薄盤的分析及設計(3/3) | Co-PI | 國科會 | 2016/01/01-2017/03/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2016 | 電子封裝球型銲點高速攝影剪向衝擊實驗與銲點界面破裂分析3/3 | PI | 國科會 | 2016/08/01-2017/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2016 | 手機相機光學防手震模組之設計與驗證 | Co-PI | 恩得利工業股份有限公司 | 2016/01/01-2016/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2015 | 產學計畫(開發型)-高倍率射出發泡成型系統之研發(1/3) | PI | 香港商加和國際有限公司台灣分公司 | 2015/06/01-2016/05/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2015 | 產學計畫(開發型)-高倍率射出發泡成型系統之研發(1/3) | PI | 國科會 | 2015/06/01-2016/05/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2015 | 電子封裝球型銲點高速攝影剪向衝擊實驗與銲點界面破裂分析2/3 | PI | 國科會 | 2015/08/01-2017/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2015 | 手機相機光學防手震模組之逆向工程 | Co-PI | 恩得利工業股份有限公司 | 2015/01/01-2015/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2015 | 電子封裝細長型晶元斷裂及剝離強度實驗與動態植晶參數分析(1/3) | PI | 國科會 | 2015/08/01-2018/05/15 |
| Liu, Deshin | Department of Mechanical Engineering | 2015 | 開發型產學-智能化精密級齒輪磨床研發(1/2) | PI | 陸聯精密股份有限公司 | 2015/11/01-2017/01/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2015 | 開發型產學-智能化精密級齒輪磨床研發(1/2) | PI | 國科會 | 2015/11/01-2017/01/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2015 | 開發型產學-智能化精密級齒輪磨床研發(1/2) | PI | 上銀科技股份有限公司 | 2015/11/01-2017/01/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2015 | 2015中正大學前瞻製造技術學生業界實習與專題研究計畫 | PI | 興農工業股份有限公司 | 2015/11/01-2016/04/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2015 | 莊鎮瑋博士後-高倍率射出發泡成型系統之研發(1/3) | PI | 國科會 | 2015/11/01-2016/05/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2015 | 網際虛擬工具機加工精度分析、補償與監控技術之研發 | Co-PI | 國科會 | 2015/05/01-2016/03/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2015 | 鞋材材料性質測試與分析委託專案 | PI | 寶成工業股份有限公司 | 2015/01/01-2015/03/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2015 | 台俄(RU)國合計畫-考慮包辛格效應之薄板及薄盤的分析及設計(2/3) | Co-PI | 國科會 | 2015/01/01-2017/03/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2014 | 經濟部學界科專計畫-智能化進給系統之研發三年計畫(III) | Co-PI | 經濟部 | 2014/01/01-2014/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2014 | 台俄(RU)國合計畫-考慮包辛格效應之薄板及薄盤的分析及設計(1/3) | Co-PI | 國科會 | 2014/01/01-2017/03/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2014 | 台斯國合計畫－新型超細微粒鋁基複材成型製程、機械強度與磨潤特性之研究(3/3) | PI | 國科會 | 2014/01/01-2014/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2014 | 電子封裝球型銲點高速攝影剪向衝擊實驗與銲點界面破裂分析1/3 | PI | 國科會 | 2014/08/01-2017/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2014 | 電子封裝探針卡多層針型分析模型與針測實驗方法之研究(3/3) | PI | 國科會 | 2014/08/01-2015/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2013 | 以彈塑性機制探討薄板之壓力相依的降伏行為之研究(3/3) | PI | 國科會 | 2013/08/01-2014/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2013 | 超高精密級齒輪磨床研發 | PI | 上銀科技工業股份有限公司 | 2013/08/01-2016/01/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2013 | 台斯國合計畫－新型超細微粒鋁基複材成型製程、機械強度與磨潤特性之研究(2/3) | PI | 國科會 | 2013/01/01-2014/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2013 | COF封裝型態之塗膠製程的模流分析 | PI | 南茂科技股份有限公司 | 2013/09/01-2013/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2013 | ILB接合強度暨COF Package 強度量測及模擬 | PI | 南茂科技股份有限公司 | 2013/09/01-2013/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2013 | 電子封裝探針卡多層針型分析模型與針測實驗方法之研究(2/3) | PI | 國科會 | 2013/08/01-2015/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2013 | 動態模擬分析COF內引腳接合過程中頂針實作之歷程 | PI | 南茂科技股份有限公司 | 2013/01/01-2013/06/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2013 | COF封裝引腳滑移現象之模擬與分析 | PI | 南茂科技股份有限公司 | 2013/01/01-2013/06/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2013 | COF封裝熱壓頭表面溫度分析 | PI | 南茂科技股份有限公司 | 2013/01/01-2013/06/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2012 | 台斯國合計畫－新型超細微粒鋁基複材成型製程、機械強度與磨潤特性之研究(1/3) | PI | 國科會 | 2012/01/01-2014/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2012 | 覆晶軟板式FCOF凸塊/引腳結構分析與晶面損傷模擬及導熱設計測試分析之研究 | PI | 南茂科技股份有限公司 | 2012/01/01-2013/06/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2012 | 以彈塑性機制探討薄板之壓力相依的降伏行為之研究(2/3) | PI | 國科會 | 2012/08/01-2014/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2012 | 電子封裝探針卡多層針型分析模型與針測實驗方法之研究(1/3) | PI | 國科會 | 2012/08/01-2015/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2012 | 非均質中底鞋材在不同速率衝擊下材料性質分析與緩衝效應評估 | PI | 寶元科技股份有限公司 | 2012/08/01-2013/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2012 | 經濟部學界科專計畫-智能化進給系統之研發三年計畫(II) | Co-PI | 經濟部 | 2012/12/01-2014/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2011 | 運動鞋吸震效應評估分析建立與動態足壓分析 | PI | 寶元科技股份有限公司 | 2011/05/01-2012/04/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2011 | 覆晶軟板式COF應力分析與晶片強度測試及奈米碳球導熱設計之研究 | PI | 南茂科技股份有限公司 | 2011/01/01-2011/12/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2011 | 經濟部學界科專計畫-智能化進給系統之研發三年計畫(I) | Co-PI | 經濟部 | 2011/12/01-2014/11/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2011 | 以彈塑性機制探討薄板之壓力相依的降伏行為之研究(1/3) | PI | 國科會 | 2011/08/01-2014/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2011 | 電子封裝無鉛銲錫接點之高速剪向衝擊實驗發展與抗撞分析之研究(3/3) | PI | 國科會 | 2011/08/01-2012/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2011 | 電子封裝TSV超薄晶元之裂片強度測試實驗與針測參數分析方法之研發 | PI | 國科會 | 2011/08/01-2012/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2011 | 提升軟性薄膜高分子電晶體效能之新穎材料、製程、封裝、與元件設計研究(3/3) | Co-PI | 國科會 | 2011/08/01-2012/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2010 | 多元尺度奈微米大面積壓印技術於顯示器之應用-子計畫五：多元尺度奈微米光學組件力學分析與封合技術(3/3) | PI | 國科會 | 2010/08/01-2011/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2010 | 熱軋鋼材材質預測模式數值演算程式建構與驗證 | PI | 中國鋼鐵股份有限公司 | 2010/01/01-2010/10/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2010 | 台俄國合計畫-壓力相依黏塑性模型之建立及其在近摩擦界面之應用(3/3) | Co-PI | 國科會 | 2010/08/01-2011/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2010 | 膜結構建築用布膜之應力與應變模式研究 | PI | 財團法人紡織產業綜合研究所 | 2010/03/01-2010/11/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2010 | 科學工業園區研發精進產學合作計畫─奈米碳球在半導體封裝散熱技術之研發 | PI | 科學工業園區管理局 | 2010/10/01-2011/09/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2010 | 提升軟性薄膜高分子電晶體效能之新穎材料、製程、封裝、與元件設計研究(2/3) | Co-PI | 國科會 | 2010/08/01-2011/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2010 | 電子封裝無鉛銲錫接點之高速剪向衝擊實驗發展與抗撞分析之研究(2/3) | PI | 國科會 | 2010/08/01-2012/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2010 | 以奈米機制增進機械性質及界面磨潤特性之探討(2/3) | Co-PI | 國科會 | 2010/08/01-2011/10/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2010 | I-MOTION連桿伺服沖床之結構優化分析 | PI | 金豐機器工業股份有限公司 | 2010/05/01-2011/04/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2010 | 覆晶軟板式COF凸塊設計、晶片強度與奈米碳球導熱設計與分析之研究 | PI | 南茂科技股份有限公司 | 2010/01/01-2011/06/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2010 | 運動鞋之動態壓力測試建立與脫膠疲勞破壞分析 | PI | 寶元科技股份有限公司 | 2010/05/01-2011/04/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2009 | 科學工業園區固本精進研究計畫－先進超薄晶圓之針測技術研發 | PI | 科學工業園區管理局 | 2009/05/01-2010/04/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2009 | 運動鞋之脫膠模擬與鞋模鑄造之熱翹曲分析 | PI | 寶元科技股份有限公司 | 2009/05/01-2010/04/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2009 | 由慢性疾病微創手術之科技創新探討高齡化社會之全面健康照護策略模式：以退化性膝關節炎為例 | PI | 行政院國家科學技術發展基金管理會 | 2009/06/01-2010/11/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2009 | 以奈米機制增進機械性質及界面磨潤特性之探討(1/3) | Co-PI | 國科會 | 2009/08/01-2011/10/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2009 | 多元尺度奈微米大面積壓印技術於顯示器之應用-子計畫五：多元尺度奈微米光學組件力學分析與封合技術(2/3) | PI | 國科會 | 2009/08/01-2011/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2009 | 台俄國合計畫-壓力相依黏塑性模型之建立及其在近摩擦界面之應用(2/3) | Co-PI | 國科會 | 2009/08/01-2011/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2009 | 提升軟性薄膜高分子電晶體效能之新穎材料、製程、封裝、與元件設計研究(1/3) | Co-PI | 國科會 | 2009/08/01-2010/09/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2009 | 覆晶軟板式COF短邊凸塊配置設計之應力分析與散熱貼片與FCOF封裝體之熱傳導分析之研究 | PI | 南茂科技股份有限公司 | 2009/01/01-2009/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2009 | 手動輪椅結構參數優化分析 | PI | 財團法人自行車暨健康科技工業研究發展中心 | 2009/04/01-2009/06/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2009 | 電子封裝無鉛銲錫接點之高速剪向衝擊實驗發展與抗撞分析之研究(1/3) | PI | 國科會 | 2009/08/01-2012/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2008 | 封裝銲錫接點高速衝擊實測與分析(I) | PI | 精材科技股份有限公司 | 2008/01/01-2008/12/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2008 | 微力彎矩實測試與分析 | PI | 台灣積體電路製造股份有限公司 | 2008/10/01-2009/06/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2008 | 牙齒舌側矯正元件製造分析與齒型變形模擬 | Co-PI | 國科會 | 2008/08/01-2009/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2008 | 多元尺度奈微米大面積壓印技術於顯示器之應用-子計畫五：多元尺度奈微米光學組件力學分析與封合技術(1/3) | PI | 國科會 | 2008/08/01-2011/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2008 | 東台精機產學合作計畫-新一世代智慧型主軸開發 | SI | 東台精機股份有限公司 | 2008/06/01-2008/08/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2008 | 探針卡可靠度實測與分析 | PI | 南茂科技股份有限公司 | 2008/07/01-2009/06/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2008 | 台俄國合計畫-壓力相依黏塑性模型之建立及其在近摩擦界面之應用(1/3) | Co-PI | 國科會 | 2008/08/01-2011/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2008 | 覆晶軟板式COF/ILB銲接參數與COF封裝元件熱傳分析之研究 | PI | 南茂科技股份有限公司 | 2008/01/01-2008/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2008 | 無鉛銲錫接點微衝擊實驗分析(2) | PI | 南茂科技股份有限公司 | 2008/01/01-2008/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2008 | 運動鞋之有限元素分析方法建立與脫膠模擬分析 | PI | 寶元科技股份有限公司 | 2008/05/01-2009/04/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2008 | 熱軋製程鋼胚微觀組織演化預測研究 | PI | 中國鋼鐵股份有限公司 | 2008/08/01-2009/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2007 | OELD封裝製程UV封合固化參數對膠膜的黏合性與可靠度之研究(3/3) | PI | 國科會 | 2007/08/01-2008/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2007 | 東台產學合作計畫-新一世代智慧型主軸開發 | SI | 東台精機股份有限公司 | 2007/08/01-2007/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2007 | 96年度探針卡可靠度實測與分析 | PI | 南茂科技股份有限公司 | 2007/01/01-2008/05/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2007 | 車輛結構對行人安全分析模型之研究 | PI | 國科會 | 2007/07/01-2008/02/28 |
| Liu, Deshin | Department of Mechanical Engineering | 2007 | 智慧型空氣氣囊系統參數分析研究 | PI | 全興創新科技股份有限公司 | 2007/07/01-2007/11/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2007 | 運動鞋之有限元素模型建立與靜/動態模擬分析 | PI | 寶元科技股份有限公司 | 2007/05/01-2008/04/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2007 | 無鉛銲錫接點微衝擊實驗測試與損傷模式分析 | PI | 南茂科技股份有限公司 | 2007/01/01-2007/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2007 | 晶粒捲帶式封裝(COF)銲合參數與電路板翹曲分析之研究 | PI | 南茂科技股份有限公司 | 2007/01/01-2007/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2007 | 車輛結構與乘員安全系統暨車輛結構次系統抗撞設計研發技術(第三年度) | PI | 私立大葉大學 | 2007/12/01-2008/11/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2007 | 側撞安全防護系統分析研究 | PI | 全興創新科技股份有限公司 | 2007/12/01-2009/05/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2006 | 散熱膠接觸熱阻係數量測實驗與分析(II) | PI | 台灣積體電路製造股份有限公司 | 2006/07/01-2006/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2006 | 車輛結構與乘員安全系統暨車輛結構次系統抗撞設計研發技術(第二年度) | PI | 私立大葉大學 | 2006/12/01-2007/11/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2006 | 奈米壓印技術應用於製作金屬次微米結構之研究-子計畫三：奈米壓印材料機械性質與成形數值分析方法之研究(3/3) | PI | 國科會 | 2006/08/01-2007/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2006 | OELD封裝製程UV封合固化參數對膠膜的黏合性與可靠度之研究(2/3) | PI | 國科會 | 2006/08/01-2007/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2006 | TFT-LCD 八代自動倉儲系統台車之舉匝機構強度、動態模擬分析技術研究 | Co-PI | 高僑自動化科技股份有限公司 | 2006/05/01-2007/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2006 | 探針卡可靠度實測與分析 | PI | 南茂科技股份有限公司 | 2006/07/01-2007/06/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2005 | 散熱膠熱阻係數量測實驗與分析研究 | PI | 台灣積體電路製造股份有限公司 | 2005/07/01-2005/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2005 | 奈米壓印技術應用於製作金屬次微米結構之研究-子計畫三：奈米壓印材料機械性質與成形數值分析方法之研究(2/3) | PI | 國科會 | 2005/08/01-2006/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2005 | OELD封裝製程UV封合固化參數對膠膜的黏合性與可靠度之研究(1/3) | PI | 國科會 | 2005/08/01-2006/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2005 | 南科投資審查案「信特科技股份有限公司」申請於南科設立公司 | Co-PI | 南部科學工業園區管理局 | 2005/10/27-2005/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2005 | 空氣囊設計原理與測試方法技術建立 | PI | 全興創新科技股份有限公司 | 2005/03/15-2005/07/15 |
| Liu, Deshin | Department of Mechanical Engineering | 2005 | 車輛結構與乘員安全系統暨車輛結構次系統抗撞設計研發技術(第一年度) | PI | 私立大葉大學 | 2005/12/01-2006/11/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2004 | 車輛碰撞安全與人體損傷降低之中長期整合性研究規劃計畫 | PI | 財團法人車輛研究測試中心 | 2004/01/01-2004/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2004 | 大型車輛安全防護裝置優化與標準化之分析技術的建立 | PI | 財團法人車輛研究測試中心 | 2004/01/01-2004/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2004 | 微間距高腳數低溫覆晶接合與測試技術之開發 | PI | 南茂科技股份有限公司 | 2004/11/01-2005/10/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2004 | 奈米結構模具脫模機制之研究 | Co-PI | 財團法人工業技術研究院機械所 | 2004/03/01-2004/11/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2004 | 奈米壓印技術應用於製作金屬次微米結構之研究-子計畫三：奈米壓印材料機械性質與成形數值分析方法之研究(1/3) | PI | 國科會 | 2004/08/01-2005/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2003 | 高鋒工業股份有限公司進駐中部科學園區營運計畫 | Co-PI | 高鋒工業股份有限公司 | 2003/04/01-2003/06/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2003 | 九十二年度「精密機電設計與整合科技教育」產學聯盟教育第三梯次－先進光電、半導體產學研討會暨座談會 | Co-PI | 教育部 | 2003/09/30-2003/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2003 | 94-97 精密機電科技教育改進計畫先期規劃－先進精密製程教學改進計畫 | Co-PI | 教育部 | 2003/08/01-2003/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2003 | 結合光彈法與雲紋干涉法量測透明塑膠體的殘留應力 | PI | 國科會 | 2003/07/01-2004/02/29 |
| Liu, Deshin | Department of Mechanical Engineering | 2003 | 銅導線晶片之銲線製程研究(3/3)-子計畫四：銲線製程參數對銅晶片強度與破壞模式之影響研究 | PI | 國科會 | 2003/08/01-2004/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2003 | 光學玻璃基板覆晶封裝技術之開發 | PI | 南茂科技股份有限公司 | 2003/11/01-2004/10/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2003 | 可同時進行多晶片平行測試之高速高頻微機電探針卡 | PI | 南茂科技股份有限公司 | 2003/07/01-2004/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2002 | 氣囊防護衣動態展開電腦模擬的建立與抗撞性分析 | PI | 中山科學研究院 | 2002/02/01-2002/11/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2002 | 實車碰撞設備之應用分析與車體撞擊分析程序之技術建立 | PI | 財團法人車輛研究測試中心 | 2002/01/01-2002/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2002 | 多晶片模組覆晶銲點應力模型分析 | PI | 財團法人國防工業發展基金會 | 2002/01/01-2002/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2002 | 「諾亞超導科技股份有限公司」投資審查案 | Co-PI | 台南科學工業園區開發籌備處 | 2002/07/08-2002/08/07 |
| Liu, Deshin | Department of Mechanical Engineering | 2002 | 銅導線晶片之銲線製程研究(2/3)-子計畫四:銲線製程參數對銅晶片強度與破壞模式之影響研究 | PI | 國科會 | 2002/08/01-2003/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2002 | 預衝擊疲勞載荷對機車安全帽保護性之影響研究(2/2) | PI | 國科會 | 2002/08/01-2003/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2002 | 封裝錫鉛銲球拉伸實驗的設計與實作 | PI | 國科會 | 2002/07/01-2003/02/28 |
| Liu, Deshin | Department of Mechanical Engineering | 2001 | 機車氣囊防護衣安全性分析 | PI | 中山科學研究院 | 2001/02/01-2001/11/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2001 | 銅導線晶片之銲線製程研究(1/3) －子計畫四：銲線製程參數對銅晶片強度與破壞模式之影響研究 | PI | 國科會 | 2001/08/01-2002/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2001 | 預衝擊疲勞載荷對機車安全帽保護性之影響研究(1/2) | PI | 國科會 | 2001/08/01-2002/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2001 | 臺灣南部電子封裝科技之產學調查 | PI | 行政院國家科學委員會工程科技推展中心 | 2001/10/01-2001/12/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2001 | 新式樣68449號/賴武雄君之沙發產品 | PI | 順發興實業有限公司 | 2001/01/08-2001/02/07 |
| Liu, Deshin | Department of Mechanical Engineering | 2001 | 新式樣425225號&特力翠豐公司之圓柱馬賽克單壁燈 | PI | 名捷照明有限公司 | 2001/05/11-2001/06/11 |
| Liu, Deshin | Department of Mechanical Engineering | 2000 | 電子構裝熱音波銲金線製程研究－總計畫(3/3) | Co-PI | 國科會 | 2000/08/01-2001/10/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2000 | 電子構裝熱音波焊接製程研究－子計畫四：熱音波焊接製程之銲線路徑研究(3/3) | PI | 國科會 | 2000/08/01-2001/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2000 | 齒輪潤滑油省能源特性之研究 | PI | 國科會 | 2000/10/01-2001/09/30 |
| Liu, Deshin | Department of Mechanical Engineering | 2000 | 快閃式記憶卡讀卡器專利侵害鑑定 | PI | 精威科技股份有限公司 | 2000/02/01-2000/03/10 |
| Liu, Deshin | Department of Mechanical Engineering | 2000 | 新型第113391號「改良門、窗之框體結構」專利侵害鑑定 | PI | 信元實業股份有限公司 | 2000/03/02-2000/04/01 |
| Liu, Deshin | Department of Mechanical Engineering | 2000 | 新型第108279號「鋁窗底座擋風塊」專利侵害鑑定 | PI | 信元實業股份有限公司 | 2000/03/02-2000/04/01 |
| Liu, Deshin | Department of Mechanical Engineering | 2000 | 倉儲系統鋼結構設計與分析 | PI | 協固事業 | 2000/07/10-2000/08/10 |
| Liu, Deshin | Department of Mechanical Engineering | 2000 | 應用雲紋干涉法進行堆疊式多晶片之熱變形量測 | PI | 南茂科技股份有限公司 | 2000/06/01-2000/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 2000 | 新型專利155290號&「順益珠寶禮品商行」侵害鑑定 | PI | 玉金鄉國際有限公司 | 2000/08/22-2000/09/22 |
| Liu, Deshin | Department of Mechanical Engineering | 2000 | 半自動吹風機與發明專利公告378178號侵害鑑定 | PI | 銓寶工業股份有限公司 | 2000/11/15-2000/12/14 |
| Liu, Deshin | Department of Mechanical Engineering | 1999 | 電子構裝熱音波桿製程研究 (2/3) －子計畫四：熱音波桿製程之銲線路徑研究 | PI | 國科會 | 1999/08/01-2000/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 1999 | 前乘客座乘員動態分析 | PI | 中山科學研究院 | 1999/08/01-2000/11/30 |
| Liu, Deshin | Department of Mechanical Engineering | 1999 | 新型專利公告第200117號「室內高架地板之收邊隔震裝置(二)」專利侵害鑑定 | PI | 惠亞工程股份有限公司 | 1999/06/24-1999/06/30 |
| Liu, Deshin | Department of Mechanical Engineering | 1999 | 新型第098254號「可攜式硬碟機及印表機介面盒追加(三)」專利侵害鑑定 | PI | 精威科技股份有限公司 | 1999/07/01-1999/07/10 |
| Liu, Deshin | Department of Mechanical Engineering | 1999 | 第272688專利(鴻海精密)與「具彈片之連接器」(康祐電子)構造之差異專利鑑定 | PI | 康佑電子股份有限公司 | 1999/06/29-1999/07/07 |
| Liu, Deshin | Department of Mechanical Engineering | 1999 | 新型第139096號「電連接器」專利侵害鑑定 | PI | 琪祥實業股份有限公司 | 1999/08/01-1999/10/30 |
| Liu, Deshin | Department of Mechanical Engineering | 1998 | 電子構裝熱音波銲金線製程研究－總計畫(1/3) | Co-PI | 國科會 | 1998/08/01-1999/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 1998 | 電子構裝熱音波銲接製程研究－子計畫四：熱音波銲接製程之銲線路徑研究(1/3) | PI | 國科會 | 1998/08/01-1999/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 1998 | 應用雲紋干涉法與有限元素模型分析PQEP型電子構裝之熱變形（二） | PI | 國科會 | 1998/08/01-1999/07/31 |
| Liu, Deshin | Department of Mechanical Engineering | 1998 | 南科專案重點補助研究計畫：晶元尺寸封裝多晶元記憶模組 | Co-PI | 國科會 | 1998/05/01-1999/04/30 |
| Liu, Deshin | Department of Mechanical Engineering | 1998 | 混合式充氣器質流率對氣囊展開之研究 | PI | 中山科學研究院 | 1998/08/01-1999/05/31 |
Patents
Print-friendly| Patents | Apply Date | Apply Number | Patent Number | Patent Country | Inventor |
|---|---|---|---|---|---|
| 具有頂鍛力傳遞系統的摩擦攪拌銲接頭 | 2021/06/03 | 110120280 | 發明第I757197號 | R.O.C | Liu, De-Shin |
| 具有隔熱系統的摩擦攪拌銲接頭及銲接刀把 | 2021/06/03 | 110120279 | 發明第I768952號 | R.O.C | Liu, De-Shin |
| 具有冷卻系統的摩擦攪拌銲接頭及銲接刀把 | 2021/06/03 | 110120278 | 發明第I765735號 | R.O.C | Liu, De-Shin |
| 可判斷進刀深度的摩擦攪拌銲接頭及銲接刀把 | 2021/06/03 | 110120277 | 發明第I765734號 | R.O.C | Liu, De-Shin |
| 模組化的摩擦攪拌銲接頭 | 2021/06/03 | 110120276 | 發明第I765733號 | R.O.C | Liu, De-Shin |
| 模組化的摩擦攪拌銲接刀把 | 2021/06/03 | 110120275 | 發明第I757196號 | R.O.C | Liu, De-Shin |
| 工具機支撐重心評估方法 | 2018/02/26 | 107106381 | I663516 | R.O.C | Liu, De-Shin |
| 工具機支撐重心評估方法 | 2018/07/18 | 16/038,378 | US 10,493,584 B2 | U.S.A. | Liu, De-Shin |
| 安全帽之襯墊 | 2019/07/08 | 108123989 | I693037 | R.O.C | Liu, De-Shin |
| 積層製造之晶格結構生成以及評估方法 | 2020/07/02 | 109122355 | 發明第I799721號 | R.O.C | Liu, De-Shin |
| 含植物纖維之積層列印軟材料 | 2020/10/15 | 109135719 | 發明第I749811號 | R.O.C | Liu, De-Shin |
Source：Chung Cheng Academic Achievements Information System