International Conference | Year | Host Country | Host City | Host Organization | Character |
---|---|---|---|---|---|
International Conference on Electronics Packaging 2024 | 2024 | JAPAN | 富山 | JIEP (The Japan Institute of Electronics Packaging) | Publish a paper |
19th International Microsystems, Packaging, Assembly and Circuits Technology Conference | 2024 | R.O.C | 台北市 | Institute of Electrical and Electronics Engineers | Publish a paper |