Scholar's profile
Huang, Peichen
Assistant Professor
Advanced Institute of Manufacturing with High-Tech Innovations
Scopus Data (view scopus profile)
Publication Achievements
2015 - 2025
Publication Index
Documents
47
CITATIONS
209
H-INDEX
8
FWCI
0.30
Co-authors
75
Last Sync Date: 2025-08-17
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ORCID
Scopus
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1Article
Microstructure and mechanical properties modification through in-situ heat treatment of AlSi10Mg/CNTs Composites prepared through additive manufacturing
Materials Letters 2025, 3980Citation0.00FWCI -
2Article
Uniaxial tensile and compressive deformation performance of closed-cell aluminum hybrid foams
Materials Chemistry and Physics 2025, 3421Citation0.00FWCI -
3Article
Demonstration of curing degree estimation approach of EVA foam during injection moulding by integrating thermal–physical characteristics and FEA simulation
Polymer Bulletin 2025, 82 (5) , 1643-16620Citation0.00FWCI -
4Article
Microstructural and mechanical properties study of various lattice structures of SS316L-CNTs nano composites fabricated through additive manufacturing
Journal of Physics D Applied Physics 2025, 58 (6)1Citation0.00FWCI -
5Article
Manufacturing Reliability Assessment of Fine Ag Alloy Wire During Wire Loop Formation Process
IEEE Access 2025, 13 , 14177-141850Citation0.00FWCI -
6Article
Investigation of process-induced periodic structure on n-type 4H-SiC with corresponding mechanical characteristics estimation
Materials Today Communications 2024, 380Citation0.00FWCI -
7Article
Injection moulding process parameter and strain rate dependence mechanical properties measurement and theoretical estimation of EVA polymer foam
Journal of Mechanics 2024, 40 , 1-92Citation0.79FWCI -
8Conference Paper
Temperature Dependence Mechanical Characteristics of Ag Alloy Wire and Corresponding Influence in Wire Bonding Procedure
2024 International Conference on Electronics Packaging Icep 2024 2024 , 157-1580Citation0.00FWCI -
9Conference Paper
Experimental and Numerical Investigation on Dynamic Response of Flip Chip Package Under Board Level Drop Test
Proceedings of Technical Papers International Microsystems Packaging Assembly and Circuits Technology Conference Impact 2024 , 307-3100Citation0.00FWCI -
10Article
Development and Demonstration on Process-Oriented Warpage Simulation Methodology of Fan-Out Panel-Level Package in Multilevel Integration
IEEE Transactions on Components Packaging and Manufacturing Technology 2023, 13 (12) , 2016-20237Citation0.72FWCI
Projects
Print-friendly| Teacher's name | Research Units | Year | Project title | Project position | Commissioning unit | Implementation period |
|---|---|---|---|---|---|---|
| Huang, Peichen | Advanced Institute of Manufacturing with High-Tech Innovations | 2025 | 專業技術服務-真空閥門元件接觸表面鍍層變形分析 | Co-PI | 日揚科技股份有限公司 | 2025/04/01-2025/07/31 |
| Huang, Peichen | Advanced Institute of Manufacturing with High-Tech Innovations | 2025 | 晶片封裝交互作用負載下先進場效電晶體結構與通道材料之應力引致電性效能分析與設計優化 | PI | 國家科學及技術委員會 | 2025/08/01-2026/07/31 |
| Huang, Peichen | Advanced Institute of Manufacturing with High-Tech Innovations | 2024 | 新世代HBPoP高散熱結構之探討 | SI | 日月光半導體製造股份有限公司 | 2024/10/01-2025/09/30 |
| Huang, Peichen | Advanced Institute of Manufacturing with High-Tech Innovations | 2024 | 補助前瞻製造系統頂尖研究中心黃北辰博士級研究人員於113年4月赴日本Toyama參加 International Conference on Electronics Packaging 2024 | PI | 國科會 | 2024/04/01-2024/04/30 |
| Huang, Peichen | Advanced Institute of Manufacturing with High-Tech Innovations | 2023 | IC包裝用 JEDEC Tray 符合最佳結構強度以延長使用壽命之探討 | SI | 日月光半導體製造股份有限公司 | 2023/10/01-2024/09/30 |
| Huang, Peichen | Advanced Institute of Manufacturing with High-Tech Innovations | 2023 | IC包裝用JEDEC Tray符合最佳結構強度以延長使用壽命之探討 | SI | 日月光半導體製造股份有限公司 | 2023/10/01-2024/09/30 |
Source：Chung Cheng Academic Achievements Information System